2023年4期
刊物介紹
本刊供我國高技術(shù)研究人員及時(shí)發(fā)表其研究成果和進(jìn)行國內(nèi)、國際學(xué)術(shù)交流的園地，旨在促進(jìn)我國高技術(shù)研究的發(fā)展和擴(kuò)大其在國內(nèi)外的影響。內(nèi)容涉及生物、計(jì)算機(jī)、電子與光電子技術(shù)、現(xiàn)代通訊、自動(dòng)化、機(jī)器人能源、新材料、海洋及其它高技術(shù)領(lǐng)域，主要讀者對象是科研院所研究人員、科技管理人員、大專院校師生及大中型企業(yè)科研人員。
High Technology Letters
- Design and implementation of control system for superconducting RSFQ circuit①
- RotatS:temporal knowledge graph completion based on rotation and scaling in 3D space①
- A novel adaptive temporal-spatial information fusion model based on Dempster-Shafer evidence theory①
- A dynamic fusion path planning algorithm for mobile robots incorporating improved IB-RRT?and deep reinforcement learning①
- Deep learning-based automated grading of visual impairment in cataract patients using fundus images①
- Research on dual-command operation path optimization based on Flying-V warehouse layout①
- Two stream skeleton behavior recognition algorithm based on Motif-GCN①
- A fault recognition method based on clustering linear regression①
- Design space exploration of neural network accelerator based on transfer learning①
- Neural network hyperparameter optimization based on improved particle swarm optimization①
- Research on cognitive load evaluation with subjective method in manual assembly①