迪思科科技（中國）有限公司及幾款半導體加工設備的介紹

DISCO 為全球最大半導體劃片，磨片，拋光加工設備供應商。迪思科科技（中國）有限公司為其在華的全資子公司。

本公司現有專業的現場服務工程師、工藝開發工程師超過80 名、并在上海、蘇州、北京、天津、成都、深圳、大連、西安、惠州、廈門及武漢設有分公司或辦事處, 實現了中國大陸半導體產業發達地區的全面覆蓋。

本公司在上海總部配備有 DGP8761、DFD6362 、DFD6340 、DFL6560 、DAD3650 、,DAD3350、DAD322、DFG8540、DFL7020 等供工藝開發和人員培訓的設備。

DISCO 總公司連續11年獲得Intel 公司的最佳供應商獎，全球僅此一家。本公司作為DISCO全資子公司，也獲得了Intel 在華分公司的高度評價與認可。三星、海太、華潤、天水華天等多家國內外半導體制造企業也對本公司的產品質量和售后服務都有良好評價，并成為本公司的忠實客戶。

以下就幾款設備作一些簡單介紹：

The DAD3650 is a manual dicer with facing dual spindles having high throughput and compact footprint.

Advantages:

High Throughput Compact Footprint Process ability Operability□Reduced process time by using a dual cut□High speed X,Y and Z-axes□Distance between blades:24 mm□World's smallest dual dice□8"/250 mm sq.work piece capable□Handles various dual spindle applications□Color touch panel+GUI□Automatic alignment installed as standard

The DFD6560 is a fully automatic dicer for準300 mm wafers, featuring a space-saving layout ideal when installing multiple units in the same area.

Advantages:

Space saving Improved throughput Optional measures to eliminate particles User friendliness□16%smaller footprint than the DFD6362□Concentrated front access□Eliminates the need for side maintenance areas□Built-in optional units□Thin-type 20 mm wheel cover□Atomizing nozzle cleaning□Function to prevent drying and adhesion□Graphical display enabling Intuitive operation□Kerf check error recovery□MTBA status display

The DFL7161 is a fully automatic laser saw with support for 準300mm wafers, which improves the productivity and reliability.

Advantages:

Improved throughput Shortened MTTR Ease of use Major applications□Independent coater and spinner□Improved high acceleration speed of the X-axis□Dedicated optical system for grooving,BSS6 installed□Improved laser monitoring function□Operation screen mode added□Low-k grooving□Si full cut

The DAS8930 is a semi-auto surface planer which is simple and compact. Optional for R&D,small production, multiple work piece processing.

Advantages:

Targets Unit configuration Operability□Ultra precision cutting process which diamond bit is used□Biggest wafer size 準300 mm□Thickness variation within a wafer≦3.0 μm□Surface roughness of bump(Rz)≦□Compact semi-auto device□1 axis 1 chuck table□Wafer thickness measuring part loaded□2.0 kW spindle□DISCO's operation common to grinders which is convenient to use□Safety(obtained CE,conforms to Semi S2-0703 or S8-1103)