第12屆電子封裝技術(shù)和高密度封裝國(guó)際會(huì)議征文通知

第12屆電子封裝技術(shù)和高密度封裝國(guó)際會(huì)議征文通知

第十二屆電子封裝技術(shù)和高密度封裝國(guó)際會(huì)議(ICEPT-HDP2011)將于2011年8月8日～11日在中國(guó)上海舉行。會(huì)議由中國(guó)電子學(xué)會(huì)電子制造與封裝技術(shù)分會(huì)(EMPT)主辦，由上海大學(xué)承辦。ICEPT-HDP系列會(huì)議多年來(lái)得到了IEEE-CPMT的全力支持和IMAPS、ASME和iNEMI等國(guó)際著名行業(yè)組織的積極參與。

電子封裝技術(shù)和高密度封裝國(guó)際會(huì)議為期4天，會(huì)議將通過(guò)專題講座、特邀報(bào)告、主題論壇、分會(huì)報(bào)告及論文張貼等形式交流電子封裝技術(shù)領(lǐng)域的最新進(jìn)展，感受其無(wú)窮的魅力。

大會(huì)誠(chéng)邀您的參與，共襄盛舉！

會(huì)議主題

●先進(jìn)封裝與系統(tǒng)集成：球柵陣列封裝、芯片級(jí)封裝、倒裝芯片；晶圓級(jí)封裝、SiP；TSV、三維集成；及其它各種先進(jìn)的封裝和系統(tǒng)集成技術(shù)。

●封裝材料與工藝：綠色材料、納米材料和其它能夠提高封裝性能和降低成本的新型材料；以及與封裝材料相關(guān)的工藝。

●封裝設(shè)計(jì)與模擬：各種新的封裝/組裝設(shè)計(jì)；電子封裝的電、熱、光和機(jī)械特性建模、模擬和驗(yàn)證方法；多尺度和多物理量建模。

●高密度基板及組裝技術(shù)：嵌入式無(wú)源和有源元件基板技術(shù)；高密度互連基板、印刷線路板、高密度高性能基板；及其它能夠提高基板密度和性能的各種新型基板技術(shù)。

●封裝設(shè)備及先進(jìn)制造技術(shù)：封裝和組裝制造設(shè)備；測(cè)量方法；提高可制造性和良品率、降低成本及改善使用可靠性的新型封裝/組裝技術(shù)。

●質(zhì)量與可靠性：質(zhì)量檢測(cè)與評(píng)估；快速可靠性數(shù)據(jù)采集和分析方法；可靠性模擬和壽命預(yù)測(cè)；失效分析和無(wú)損診斷等。

●固態(tài)照明封裝與集成:CoB、WLP及其它各種先進(jìn)的封裝和集成技術(shù)；大功率LED模組的設(shè)計(jì)、制造和測(cè)試方法；LED封裝及集成技術(shù)在顯示器背投、微型投影儀、室內(nèi)照明和街燈等方面的應(yīng)用。

●新興領(lǐng)域封裝:傳感器、執(zhí)行器、微機(jī)電系統(tǒng)、納機(jī)電系統(tǒng)、微光機(jī)電系統(tǒng)的封裝技術(shù)；光電子封裝，CMOS圖像傳感器封裝；封裝及集成技術(shù)在液晶顯示，無(wú)源元件，射頻、功率和高壓器件，及納米器件等新興領(lǐng)域的應(yīng)用。

重要日期:

●2011年4月15日論文摘要截止日期

●2011年5月22日論文接收通知日期

●2011年7月22日論文全文截止日期

論文/摘要投稿

論文內(nèi)容必須為具有原創(chuàng)性且沒(méi)有發(fā)表過(guò)的技術(shù)成果。論文摘要須用約500字的篇幅清楚地描述本工作的背景、研究方法、結(jié)果和結(jié)論，論文摘要還應(yīng)包括關(guān)鍵的參考文獻(xiàn)。論文摘要必須用英文、按所附電子模板的要求撰寫，發(fā)送到icept2011@oa.shu. edu.cn。所有錄用論文都將被收入IEEE會(huì)議論文集，優(yōu)秀論文將被推薦到IEEE-CPMT的相關(guān)期刊評(píng)審發(fā)表。

優(yōu)秀論文評(píng)選

會(huì)議文集將由IEEE官方收錄。會(huì)議將評(píng)選優(yōu)秀會(huì)議論文和優(yōu)秀學(xué)生論文，并頒獎(jiǎng)以示鼓勵(lì)。

專業(yè)課程

會(huì)議將舉辦專業(yè)培訓(xùn)課程。歡迎本領(lǐng)域的專家用電郵icept2011@oa.shu.edu.cn與大會(huì)組委會(huì)討論有關(guān)課程細(xì)節(jié)。

誠(chéng)征參展商/贊助商

大會(huì)將為電子封裝及相關(guān)工業(yè)的材料、設(shè)備、組件、軟件供應(yīng)商、制造商及服務(wù)商提供參展平臺(tái)，有意向的參展商/贊助商請(qǐng)通過(guò)如下電子信箱與大會(huì)組委會(huì)聯(lián)系:010-64655241 021-38953725。

大會(huì)主席：畢克允教授

大會(huì)執(zhí)行主席：汪敏教授

大會(huì)組織主席：張建華教授

大會(huì)技術(shù)主席：史訓(xùn)清博士

大會(huì)網(wǎng)站：http://www.icept.org

大會(huì)電郵：icept2011@oa.shu.edu.cn

大會(huì)時(shí)間：

2011年8月8-11日（8日?qǐng)?bào)到及課程培訓(xùn)）

會(huì)議地點(diǎn)/地址：

上海龍東商務(wù)酒店

上海浦東龍東大道3000號(hào)

關(guān)于上海

上海，位于中國(guó)海岸線中部的長(zhǎng)江口，是中國(guó)的經(jīng)濟(jì)、金融、貿(mào)易、航運(yùn)中心。目前，上海以其市場(chǎng)規(guī)模、制造能力和技術(shù)水平已成為中國(guó)的集成電路設(shè)計(jì)、制造和封裝中心。

上海是中國(guó)主要旅游城市，具有深厚的近代城市文化底蘊(yùn)和眾多的歷史古跡。其外灘、城隍廟和東方明珠塔都是聞名的地標(biāo)。上海素有“美食天堂”、“購(gòu)物樂(lè)園”之稱，擁有世界各國(guó)的飲食文化、經(jīng)典時(shí)尚的購(gòu)物激情和濃郁的商業(yè)氣息。并成功舉辦了2010年世界博覽會(huì)。

The 12thInternational Conference on Electronic Packaging Technology&High Density Packaging(ICEPT-HDP 2011)w ill be held in Shanghai,China, from August 08 to 11,2011.The ICEPT-HDP 2011 is organized by Electronic Manufacturing and Packaging Technology Society(EMPT)of Chinese Institute of Electronics(CIE)and co-organized by Shanghai University.The conference has received strong support from IEEE CPMT and active involvement from IMPAPS,ASME and iNEMI.

ICEPT-HDP 2011 is a four-day event,featuring technical sessions,professional development courses/forums,exhibition,and social networking activities.It aims to cover the latest technological developments in electronic packaging,manufacturing and packaging equipment,and provide opportunities to explore the trends of research and development,as well as business in China.

CONFERENCE THEMES：

●Advanced Packaging&System Integration:BGA,CSP,flip chip;WLP,SiP;TSV,3D integration; and other advanced packaging and system integration technologies.

●Packaging Materials&Processes:Green materials,nano-materials and other novel materials for packaging performance enhancement and cost reduction;and various new packaging/assembly processes.

●Packaging Design and Modeling:New packaging/assembly designs;methodologies for modeling, simulation and validation of electrical,thermal,optical and mechanical performance of various electronics packages;multi-scale and multi-physics modeling.

●High Density Substrate&SMT:Substrate w ith embedded passives and active components;HDI substrate,PCB,high performance multi-layer substrate;and various novel assembly technologies that improve substrate density and performance.

●Advanced Manufacturing Technologies and Packaging Equipment:Packaging/assembly equipment;measurement techniques;novel packaging/assembly technologies for manufacturability and yield improvement,cost reduction and service performance improvement.

●Quality&Reliability:Quality monitoring and evaluation;methodologies for accelerated reliability data collection and analysis,reliability modeling and life prediction;failure analysis and non-destructive diagnose.

●Solid State Lighting Packaging&Integration:CoB,WLP and other advanced packaging/integration technologies;methodologies for design,manufacturing and testing of high power LED module; LED packaging/integration technologies and their applications in LCD,Micro-projector,in-door lighting, street lamp,etc.

●Emerging Technologies:Sensors,actuators, MEMS,NEMS and MOEMS;optoelectronics packag-ing,CMOS image sensor packaging;packaging/integration technologies and their applications in LCD,passive &RFdevices,power&HV devices,nano-devices,etc.

IMPORTANT DATES：

●April 15,2011 Deadline for Subm ission ofAbstract

●May 22,2011 Notification of Acceptance

●July 22,2011 Deadline for Subm ission of Manuscript

SUBMISSION OF Abstract：

BEST CONFERENCE PAPERS AND BEST STUDENT PAPERS

The conference proceeding is an official IEEE publication.Best Conference and Student Papers w ill be selected and awarded at the conference.

CALL FOR PROFESSIONAL DEVELOPMENT COURSES

The conference program includes professional development courses(PDC),the leading experts in the field may email icept2011@oa.shu.edu.cn for details.

CALL FOR EXHIBITION/SPONSORSHIP

A tabletop exhibition featuring suppliers of materials,equipment,components,software,manufacturers,and service providers of the electronics packaging and related industries w ill be held during the conference.Potential exhibitors and sponsors may email faith_epe@sohu.net for details.

General Chair:Prof.Keyun BI

Executive Chair:Prof.Min WANG

Organization Chair:Prof.Jianhua ZHANG

Technical Chair:Dr.Daniel SHI

Conference Website:http://www.icept.org

Conference Email:icept2011@oa.shu.edu.cn

Conference Date

August 8～11,2011

Conference Venue

Shanghai Riverfront Business Hotel

No3000,LongDong Avenue,Pudong Shanghai,China

The 12thInt'l Conference on Electronic Packaging Technology&High Density Packaging (ICEPT-HDP 2011) CALL FOR PAPERS

s are solicited to describe original and unpublished work.The

should be approx.500 words and contains a clear statement of the background,methodology,results,conclusions,and important references of the work.AllAbstracts must be in English and should be subm itted using the format provided in the attached word file to icept2011@oa.shu. edu.cn.The template forAbstractsubm ission can be downloaded at the conference website http://www.icept.org.Selected papers w ill be recommended for publication in IEEE/CPMT journals.