EVG公司在SEMICONChina2014展示新的技術(shù)解決方案

全球領(lǐng)先的晶圓鍵合及光刻設(shè)備供應(yīng)商EV Group (EVG)日前宣布，為加強中國半導(dǎo)體市場的實力，將在中國推進批量制造工藝解決方案并在上海開設(shè)區(qū)域總部。

中國目前是世界半導(dǎo)體3D IC 集成和先進封裝技術(shù)開發(fā)與生產(chǎn)的重點地區(qū)，抗蝕劑處理是這些制造技術(shù)中一種基本的加工程序。為了取得成功并確保在全球的競爭力, 對于中國的制造廠家來說，與擁有設(shè)備、技術(shù)和專有工藝技術(shù)的主要供應(yīng)商合作，保持其制造能力迅速地由工藝開發(fā)向大批量制造過渡便顯得十分重要。

EVG150XT 系統(tǒng)是EVG 公司最新推出的產(chǎn)品,它成功地集合了EVG 公司30 多年在光刻和大批量制造工藝方面的專業(yè)知識，率先為客戶提供生產(chǎn)意義的大批量制造抗蝕劑處理系統(tǒng),它能滿足在半導(dǎo)體制造中段制程和后段制程中大多數(shù)抗蝕劑處理、旋涂介質(zhì)材料和厚膜的苛刻需求，包括用于2.5D 及3D-IC 集成的封裝技術(shù)中的硅通孔TSV 成形,晶圓鍵合、再分布層及轉(zhuǎn)接板制作等用途。

新型EVG150XT 系統(tǒng)是一種通用的全自動抗蝕劑處理機臺, 適用于直徑到300 mm 的晶圓。為滿足不斷增長及變化的半導(dǎo)體市場需求，EVG150XT 系統(tǒng)圍繞3 個關(guān)鍵方面進行開發(fā)：即改進工藝、縮短生產(chǎn)周期、智能軟件解決方案來實現(xiàn)復(fù)雜、高頻率更換工藝流程的需求。

基于XT- 結(jié)構(gòu)設(shè)計, EVG150XT 系統(tǒng)的9 個工藝模塊，能夠同時運行,實現(xiàn)多晶圓并行處理。此外, 該系統(tǒng)還集成了一個在線測量模塊, 用以檢查各種加工中的不規(guī)則性和缺陷,以便進行減少缺陷,提高成品率和降低生產(chǎn)成本的實時工藝修正。

除了推出新的工藝解決方案外, EVG 公司還通過在上海開設(shè)新的子公司擴展在中國的業(yè)務(wù),新的子公司將作為區(qū)域總部進行EVG 公司在中國境內(nèi)的全部運營業(yè)務(wù)。新的EVG 中國子公司將具有服務(wù)中心和備件管理功能, 以進一步加強EVG 公司在該地區(qū)的實力。通過新公司的不斷努力，提高對中國客戶的服務(wù)和響應(yīng)時間。

詳情請咨詢位于上海新國際展覽中心的EVG公司2451 展臺。

EV GROUP STRENGTHENS SUPPORT OF CHINESE SEMICONDUCTOR MARKET WITH VOLUME MANUFACTURING PROCESS SOLUTIONS AND NEW REGIONAL HEADQUARTERS IN SHANGHAI

China is a key region for development and production of leading semiconductor technologies such as 3D-IC integration and advanced packaging. Resist processing is an essential process step for these manufacturing technologies. To be successful and remain globally competitive, it is important for manufacturers in China to partner with key suppliers that have the equipment,technology and process expertise to support their ability to quickly transition from process development into high-volume manufacturing(HVM).

The latest product introduction from EV Group(EVG), called the EVG150XT, successfully combines EVG's expertise of more than 30 years in lithography and HVM processing to provide the first true HVM resist processing system that can meet the most demanding requirements for processing resists, spin-on dielectrics and thick films for mid-end-of-line (MEOL) and back-end-of-line (BEOL) semiconductor applications, including through silicon via (TSV) formation,wafer bumping, redistribution layer and interposer manufacturing for 2.5 and 3D-IC packaging.

The new EVG150XT is a universal and fully-automated resist processing tool supporting wafers up to 300-mm in diameter. To meet the needs of the growing and fluctuating semiconductor market, the EVG150XT was developed around three key aspects:improved processing,short cycle times,and smart software solutions for complex, high-frequency process flows.

Built on the XT-frame architecture, the EVG150XT features nine process modules that can operate simultaneously for multi-parallel wafer processing. In addition, an in-line metrology module has been integrated into the EVG150XT that can detect a variety of process irregularities and defects to enable real-time process corrections to reduce defects, increase yields and lower production costs.

Besides new process solutions, EVG has also expanded its presence in China with the opening of a wholly owned subsidiary in Shanghai, which will serve as regional headquarters for all of EVG's operations in the People's Republic of China. The new EV Group China subsidiary, which houses a local service center and spare parts management facility,further strengthens EVG's presence in the region and supports the company's ongoing efforts to improve service and response times to local customers.

EV Group will exhibit its technology solutions portfolio at SEMICON China, March 18-20, 2014.For more information, please visit EVG at Booth#2451 in the Shanghai New International Expo Center in Shanghai.